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ABS Chassis Assembly
Rigid, Flexible and Rigid-Flex - Rigid-Flex circuit interconnects featuring Blind and Buried Via’s, Micro-Via’s, Bookbinder and other cutting edge technologies. Printed Circuit Boards & Daughtercards - Fabrication capabilities include a wide variety of materials to enable increasing signal speeds, deep microvias, buried, blind and backdrilled vias, sequential lamination, panel sizes from 18" x 24" up to 24" x 54", layer counts to 60+ and board thicknesses up to .500". LRM - Designed to meet the high-density needs of today’s integrated electronic modules, this Straddle Mount connector usings the Amphenol Bristle Brush Contact which has been proven in military avionics packages and meets the requirements of MIL-C-55302. The low mating force, extended service life and stable electrical performance of he B3+ contact allows this product to provide the high level of performance demanded by today’s Line Replaceable Module (LRM) applications. Continues below...
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