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ABS Offerings >Conformal Coating >Surface Mount Technology >SolderingFor more information please contact an ABS Customer Service Representative at any time. |
Amphenol High Density Interconnects
When you're looking for high performance interconnects, ABS is capable of supplying multiple connector types integrated into a rigid or rigid-flex backplane system. ABS solutions include a wide range of connector technology to include: new Viper connectors, 0.100" X .100" NAFI fork and blade, 0.100" X 0.100" Bristle Brush, 0.100" X 0.050" Ultra High Density (UHD) fork and blade, LRM with MIL-C-55302 type bristle brush, GEN-X with MIL-C-55302 type bristle brush, ruggedized VME-64X, filtered and non-filtered MIL-C-38999, filtered and non-filtered ARINC, as well as other manufacturer's interconnect products used throughout the industry. In fact, there isn't a connector on the marketing which we haven't integrated into a backplane. Teamed with the US Navy as co-developer of solderless press-fit contact technology and the leading manufacturer of backplane systems, ABS understand the relationship between the connector and backplane. We use this knowledge to provide complete backplane systems that meet your program needs. Our interconnects meet the increasing signal and power demands of advanced military and aerospace applications. Amphenol also offers electro-optical backplane interconnect systems for advanced avionics systems requiring high speed optical/digital signal processing. Available in SEM-E or customer form factors, these systems integrate your total electrical and optical interconnect needs into one discreet package.
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