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Amphenol Backplane Assemblies

For over 35 years, ABS has been a leading manufacturer of backplane assemblies and enclosures for military and aerospace applications. ABS combines a wide range of innovative product and process technologies, advanced component manufacturing and process control with highly focused, customer specific program management and testing at the assembly level. In addition, we provide expert design and unsurpassed applications engineering assistance at every step of the way. Amphenol is the leading manufacturer of custom backplane assemblies using high-density, ruggedized, board to backplane interconnects. Our Backplane production capabilities include Press-Fit, Rigid and Rigid Flex PWB's, Surface Mount Soldering, Through-Hole Soldering, Hybrid Optical Electric and Conformal Coat.

Amphenol provides printed circuit processing capabilities that are among the world's most advanced, specializing in high technology multilayer backplane applications. We are able to offer large panel sizes with high layer counts and features such as high-aspect ratio plating, small-diameter plated-through holes, and fine lines and spaces. Investments at this stage ensure predictable, repeatable manufacturability with reduced costs. We offer this in conjunction with the Amphenol Corporation's complete breadth of interconnect products, giving our customers a one-stop solution.

Our applications engineers will help you sort through design and manufacturing issues such as:

  • Board Size
  • Layer Counts
  • Trace Routing
  • Material Selection
  • Power Distribution.


Amphenol Backplanes are required to perform in the most demanding environments such as:

  • Commercial Airliners
  • Army Helicopters
  • Navy and Air Force Fighters
  • C4I Electronics
  • Missiles
  • Ground Vehicles
  • Navy Warships.


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