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Amphenol UHD Connector Solutions

Amphenol's Ultra High Density (UHD) interconnect packaging solution combines high interconnect density (80 contacts per linear inch) and design flexibility with proven technologies to meet a wide range of advanced, high reliability packaging requirements. It is well suited for all military and aerospace programs.

The foundation of the UHD connector is a downsized version of the proven MIL-C-28859 tuning fork and MIL-C-28754 blade contact technologies. The UHD connector packages 396 contacts with two mounting attachments into the SEM-E format, using an eight rob 0.100" X 0.050" staggered grid to optimize trace routing through the backplane.

Backplane connectors use solderless compliant press-fit contacts. The module connectors are surface mounted to the module using rigid pin or flex-circuit terminations. The UHD connector has been designed to provide signal integrity and interconnect density to meet today's advanced system-level requirements while maintaining a robust design.

Designers faced with unique packaging requirements will appreciate the design flexibility of the UHD connector. A modular approach allows for straightforward incorporation of signal, pwer, coax, and fiber-optic inserts, as well as EMI shielding, all within the same connector footprint. This modular approach also enables the production of connectors that are longer or shorter than the basic SEM-E format.

For more information regarding the following connectors, click the links below.

UHD Catalog Connectors
UHD 372 Pin Connector SEM-E
UHD 296 Pin Connector with 270V Power
UHD 300-Pin Multipurpose Connector
UHD 396 Pin Connector Futurebus + SEM-E
UHD 556 Pin Connector Futurebus + 10-SU

Why Use UHD? There are many UHD connectors developed specifically to meet industry standard requirements, however, UHD's modular architecture enables Amphenol to produce connectors containing upwards of 680 contacts. Features such as coax, fiber-optic, power, EMI shielding and acommodations for module covers can be integrated into the UHD connector system. Connector length and body style can be tailored to meet specific needs, with a choice of rigid pin or flex-circuit terminations. Extender board connector configurations are also available so that customers can have access to probe and test modules that are electrically connnected to the backplane.

Below are various specifications regarding our UHD products.

UHD Operating Characteristics

Temperature Range
-65°C to +125°C
Current Rating (individual contact)
2 amps DC at 25°C
Current Rating (multiple contacts)
1 amp DC at 25°C
Dielectric Withstanding Voltage (DQV)
600V (RMS) at 60 Hz
Insulation Resistance
1,000 Megohms
Contact Resistance
30 milliohms maximum
Contact-to-Backplane Retention Force
3 lb. minimum
Contact Life (durability)
500 cycles
Contact Engagement Force
2.25 ounce maximum average
Contact Normal Force
1.0N (3.53 ozf) average
Contact Wipe Length
0.053 inch minimum

UHD Environmental Characteristics

Salt Fog MIL-STD-810 Method 509, Procedure 1
Thermal Shock MIL-STD-202 Method 107, test condition B
Humidity MIL-STD-1344 Method 1002
Shock MIL-STD-202 Method 213, test condition C
Resistance to Solder Heat EIA-364-56 Procedures 3 and 4
Vibration (sinusoidal) MIL-STD-202 Method 204, test condition G
Vibration (random) MIL-STD-202 Method 214, test condition I, letter E

UHD Module Connector Materials & Finishes

Frame Material
Aluminum alloy, 6061-T6 per ASTM B241
Frame Finish Black anodize per MIL-A-8625, Type II, Class II, or Electroless nickel plate per MIL-C-26074, Class 4.
Contact Material Brass per ASTM B36, C26000
Contact Finish 0.00005 inch (minimum) gold per MIL-G-45204 over 0.00005 inch (minimum) nickel per QQ-N-290. Solderable per MIL-STD-208
Insulator/Terminal Guide Polyphenylene Sulfide (PPS), glass-reinforced (40%) per ASTM D4067 or Liquid Crystal Polymer (LCP) per MIL-M-24519
Flex Circuit 3 ounce 1/2 hard copper per IPC-CF-150/7-CUW7-3SS3 with 0.001 inch polyimide per IPC-FC-231-1, meeting the requirements of MIL-P-50884.
Polarizing Key/Guide PIN Adhesive Stainless steel, type 303 per ASTM A582, passivated DP-190 Gray (3M Scotch-Weld)

UHD Backplane Connector Materials & Finishes

The UHD series backpalne connectors make use of ABS's "Dynamic Retention" compliant press-fit tuning fork contacts for a solderless, gas tight interface with the printed circuit backplane.

Contact Material Beryllium Copper per ASTM B194
Contact Finish 0.00005 inch (minimum) gold per MIL-G-45204 over 0.00005 inch (minimum) nickel per QQ-N-290
Insulator Material Polyester, glass-reinforced (30%) per MIL-M-24519, Type GPT-30F or Liquid Crystal Polymer (LCP) per MIL-M-24519, Type GLCD. Both are flame retardant per UL Bulletin 94 V-0. Sintered stainless steel per ASTM B582, passivated
Polarizing Bushings SIntered stainless steel per ASTM B582, passivated
EMI Shield Material Beryllium copper alloy, C17200-TD02 per Astm B194
EMI Shield Finish 0.000100/0.000250 inch thick electroless nickel per MIL-C-26074, Class I
Adhesive DP-190 Gray (3M Scoth-Weld)

 

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