FEATURES AND BENEFITS
Amphenol® HDB³ connector series offers the following:
- High density contact pattern: .070” x .060” grid spacing
- Low mated height: .500 from mother board to row A of daughter board
- Utilizes the high performance brush contact system for reliability in harsh environments
- Mounting hardware, keys and guide pins have been combined to occupy less board space
- Available in the following contact arrangements
- 40 contacts
- 80 contacts
- 120 contact
- 160 contacts
- Configurable for data rates up to 3.125 Gbps data rates per differential pair
- RoHS compliant version available
To read more about High Density HDB3 and HSB3, see catalog SL-402. For additional information on this or related products contact BLP Marketing by
Phone: (800) 678-0141 and ask to speak with BLP Marketing
or by Email: blp-marketing@amphenol-aerospace.com |
