Home > Board Level/Rectangular > HDB³
 
 
Connector Series:  
 
 
FEATURES AND BENEFITS
Amphenol® HDB³ connector series offers the following:
  • High density contact pattern: .070” x .060” grid spacing
  • Low mated height: .500 from mother board to row A of daughter board
  • Utilizes the high performance brush contact system for reliability in harsh environments
  • Mounting hardware, keys and guide pins have been combined to occupy less board space
  • Available in the following contact arrangements
    • 40 contacts
    • 80 contacts
    • 120 contact
    • 160 contacts
  • Configurable for data rates up to 3.125 Gbps data rates per differential pair
  • RoHS compliant version available
To read more about High Density HDB3 and HSB3, see catalog SL-402. For additional information on this or related products contact BLP Marketing by Phone: (800) 678-0141 and ask to speak with BLP Marketing or by Email: blp-marketing@amphenol-aerospace.com
 
 
 
 
© 2011 Amphenol Aerospace - An Amphenol Company. All Rights Reserved.
 
  
  
 Catalogs
 Conflict Metal Statement
 Data Sheets
 ISO Certification
 Reach Documents
 RoHS Documents
 Termination Instructions
  
 Credit Application
 Connector Basics
 Contact Us
 Request A Quote
  
 Amphenol One
 Amphenol Sales Force
 Customer Service
 Suppliers