FEATURES AND BENEFITS Amphenol® HDB³ connector series offers the following: High density contact pattern: .070” x .060” grid spacing Low mated height: .500 from mother board to row A of daughter board Utilizes the high performance brush contact system for reliability in harsh environments Mounting hardware, keys and guide pins have been combined to occupy less board space Available in the following contact arrangements 40 contacts 80 contacts 120 contact 160 contacts Configurable for data rates up to 3.125 Gbps data rates per differential pair RoHS compliant version available For additional information on this or related products contact BLP Marketing by Phone: (800) 678-0141 and ask to speak with BLP Marketing or by Email: blp-marketing@amphenol-aerospace.com