FEATURES AND BENEFITS
Amphenol® HDB³ connector series offers the following:
High density contact pattern: .070” x .060” grid spacing
Low mated height: .500 from mother board to row A of daughter board
Utilizes the high performance brush contact system for reliability in harsh environments
Mounting hardware, keys and guide pins have been combined to occupy less board space
Available in the following contact arrangements
40 contacts
80 contacts
120 contact
160 contacts
Configurable for data rates up to 3.125 Gbps data rates per differential pair
RoHS compliant version available
For additional information on this or related products contact BLP Marketing by
Phone: (800) 678-0141 and ask to speak with BLP Marketing
or by Email: blp-marketing@amphenol-aerospace.com