 
Choose the Amphenol® RADSERT™ design when you need the most power in a single-point connection to the PCB. The RADSERT allows the board designer to bring power to the board from busbars suspended above the board and all of the board components. Pins from the busbar plug into the RADSOK’s which are installed by press fitting the RADSOK into the RADSERT. Click here for the PCB Data Sheet.
The RADSERT is press-fit into plated-through holes in the PCB. It provides the smallest footprint and is available in 2.4mm and 3.6mm for board thicknesses of .250” +/– .025”. Other sizes may be custom designed to meet your specific application requirements. |
 |
• High power to board interconnect in a small package
• Hyperbolic socket design ensures many points of contact
• Solder version or pre-loaded RADSERTS are installed
during board fabrication
• 2.4mm RADSERT carries up to 35 Amps
• 3.6mm RADSERT carries up to 70 Amps
• No special crimp tools required
• No threaded fasteners
• Eliminates risk of PTH cracking or delamination
in board
• Faster through-put
• RoHs compliant |