FEATURES AND BENEFITS

Exceeds many MIL-DTL-38999 performance requirements
Utilizes Amphenol’s low mating force brush contacts
0.100” x 0.100” square grid footprint
Load bearing shells (supports module to rack interface)
Tapered connector mating surfaces provide near zero X-Y plane movement between mated connectors.
EMI/ESD protection in both connector halves:
EMI at mounting surfaces and connector interface (38999 III level)
ESD features allow use of Class 3 hardened chips (4KV max. voltage)
Signal speeds to 3.125 Gbps - (per differential pair and based on intelligent assignment of ground/signal pairs)
Capable of 500 mating cycles
Water tight seals both at connector interface and to mounting surfaces
“Hybrids” available - combining signal contacts with power or RF contacts