FEATURES AND BENEFITS Exceeds many MIL-DTL-38999 performance requirements Utilizes Amphenol’s low mating force brush contacts 0.100” x 0.100” square grid footprint Load bearing shells (supports module to rack interface) Tapered connector mating surfaces provide near zero X-Y plane movement between mated connectors. EMI/ESD protection in both connector halves: EMI at mounting surfaces and connector interface (38999 III level) ESD features allow use of Class 3 hardened chips (4KV max. voltage) Signal speeds to 3.125 Gbps - (per differential pair and based on intelligent assignment of ground/signal pairs) Capable of 500 mating cycles Water tight seals both at connector interface and to mounting surfaces “Hybrids” available - combining signal contacts with power or RF contacts