WaSP

The new WaSP microminiature range is designed for High-Volume Harsh-Environment Applications that Prioritize Size, Weight, Power, and Cost (SWaP-C). Based on the TERRAPIN SCE2 series (offered by Amphenol PCD), the WaSP takes the TERRAPIN's compact, rugged, lightweight design and optimizes it even further for high-volume SWaP-C applications.

The WaSP microminiature circular connector features a simplified interface designed for ease of use, quick mating, and affordability. With no jam nut and a 1/4 turn polymer locking ring, mating the WaSP is quick and easy. The WaSP utilizes a lightweight aluminum shell and locking ring that only adds minimal weight, perfect for applications that prioritize lightweight designs. Also, its low-profile size ensures it will take up minimal space in your assembly. 

The WaSP series is designed to operate in a range of harsh environments. It features IP67 environmental sealing, a passivation anti-corrosion layer, can operate in a temperature range of -55°C (-67°F) to + 85°C (185°F), and can withstand 48 hours of salt spray. Its environmental durability makes it optimal for a wide range of smaller platforms operating on land, in the air, or at sea.

 WaSP is the ideal interconnect for high-volume, low-cost SWaP-C applications such as UAVs and drone swarm technologies, UGVs, communications systems, and other applications that must strictly adhere to rigorous size, weight, power, and cost profiles. 

• Lightweight aluminum shell
• Lightweight 1/4 turn polymer
• Locking ring
• Simplified geometry
• Passivation anticorrosion layer
• Sealed IP67
• 3 keying options