WaSP

The new WaSP microminiature range is designed for High-Volume Harsh-Environment Applications that Prioritize Size, Weight, Power, and Cost (SWaP-C) Based on our TERRAPIN SCE2 series, the WaSP takes the TERRAPIN's compact, rugged, lightweight design and optimizes it even further for high-volume SWaP-C applications.

The WaSP microminiature circular connector features a simplified interface designed for ease of use, quick mating, and affordability. With no jam nut and a 1/4 turn polymer locking ring, mating the WaSP is quick and easy. Its lightweight aluminum shell and locking ring ensures the WaSP only adds minimal weight to applications that prioritize lightweight designs, and its low-profile size ensures it will take up minimal space in your assembly.

The WaSP series is designed to operate in a range of harsh environments. It features IP67 environmental sealing, a passivation anti-corrosion layer, can operate in a temperature range of -55°C (-67°F) to + 85°C (185°F), and can withstand 48 hours of salt spray. Its environmental durability makes it optimal for a wide range of smaller platforms operating on land, in the air, or at sea.

WaSP is the ideal interconnect for high-volume, low-cost SWaP-C applications such as UAVs and drone swarm technologies, UGVs, communications systems, and more. Turn to WaSP for systems intended for production and use in high quantities that must strictly adhere to rigorous size, weight, power, and cost profiles.

• Lightweight aluminum shell
• Lightweight 1/4 turn polymer
• Locking ring
• Simplified geometry
• Passivation anticorrosion layer
• Sealed IP67
• 3 keying options